WAFER TEST

Wafer Test / Laser Trimming Equipment < Test Environment >

The test environment information listed here is as of January 2025 and is provided for reference only.
For the most up-to-date specifications and testing environments, please contact us directly.

Main Test Environment for Mixed SoC Testers

Manufacturer	Model Name	Main Specifications
ADVANTEST	T6575	I/O＝512pin 125MHz , PPS=32ch　SQPG Option：SCPG 4Gbit, ALPG, AD/DA, IDDQ, 40VPPS, etc. HiFIX：512POGO , 512AV2
	T6577	I/O＝1024pin 125MHz , PPS=32ch　SQPG Option：SCPG 16Gbit, ALPG, VAFG/VAFD , 40VPPS, etc. HiFIX：1024Square AP , 512POGO
	T2000-LSMF (non-EPP)	52-slot TH PB:RECT550 800MDM 1024ch, PMU32, DPS500MA, LCDPS 250MDM 1024ch, PMU32, DPS500MA
	T7721	125MHz　I/O＝256pin　PHDC＝256pin MDC HDC SQPG MTX included
	V93000 A-TH	9-slot TH PS1600B=64MB/200Mbps/128ch/TMU:2pins WSMX=HS:4units , HR:4units DPS128=HV:64ch/HC:64ch
	EVA100 P-Model	mini-SB x1（DM64 x2、AVI x1、SYNC x1）＜Module Spec＞ DM64：100MHz_digital_I/O=64ch, PPMU=64ch, DPS=4ch, TMU/AWG/DGT/VREF AVI ：VI_Source=6ch(±64V or -32V～+96V) SYNC：I2C、SPI、DC:+5V, +12V, ±15V、CW=64ch

Analog Tester

Manufacturer	Model Name	Main Specifications
ShibaSoku	WL22	Perpin＝64ch TM＝2ch, HV V/I included CBIT＝72bit～288bit AS/AVM included
	WL25	Perpin＝64ch μFunc＝16pin～32pin TIME＝4ch CBIT＝72bit～144bit, HV V/I included
	WL25V	VPerpin＝64ch～128ch Digital Module＝16pin～32pin CBIT＝144bit～288bit TM＝8ch, HV V/I HV800V included
SPANDNIX	SX3010	ONVI_R3M＝64pin 30V/300mA QTMR＝A/B×4ch Cbit＝256ch DHVI included

Prober

Manufacturer	Model Name	Main Specifications
Tokyo Electron	P-8 Series	P8, P8XL [100mm, 125mm, 200mm] Temperature Range: Room Temperature, High-Temperature Chuck, High-Temperature AC High / Low Temperature: -40°C to 150°C
Tokyo Electron	P-12 Series	P12/XL [200mm, 300mm] Air-Cooled Configuration
ACCRETECH (Tokyo Seimitsu)	UF200 / 2000 Series	UF200/A/SA/S/R, UF2000 [125mm～200mm] High-Temperature Chuck, High-Temperature AC High / Low Temperature: -40°C to 150°C
ACCRETECH (Tokyo Seimitsu)	UF3000 Series	UF3000/EX/EXe, AP3000 [200mm, 300mm] High-Temperature Chuck, High-Temperature AC High / Low Temperature: -40°C to 150°C High / Low Temperature: -55°C to 200°C

Laser Trimming

Manufacturer	Model Name	Main Specifications
ESI	esi9275	Wavelength: 1047 nm　Wafer Size：100mm～200ｍｍ
	esi9350	Wavelength: 1342 nm　Wafer Size：100mm～200ｍｍ
	esi9820	Wavelength: 1342 nm　Wafer Size：150mm～200ｍｍ

Back Grinder / Laser Grooving

Manufacturer	Model Name	Main Specifications
DISCO	DFG8560	Wafer Size: 150mm, 200mm, 300mm 　　Finishing Wheel: #2000 / #6000 / #8000
DISCO	DFL7161	Wafer Size: 150mm, 200mm, 300mm 　　Water-soluble Protective Film (Standard)

Additional Supporting Equipment

Manufacturer	Model Name	Main Specifications
Camtek	Falcon530	Automated Optical Inspection System (AOI) – 200mm, 300ｍｍ compatible
Espec	PVHC-231M	Clean Oven
Tiatech	HOTEI	PAT Judgment System SPAT, DPAT, SBL, SYL Classification
Harmotec	HWC-0812-01	Ultrasonic Air Cleaning and Vacuum Extraction

Optimized Wafer Test Environment Covering a Wide Range of Requirements

In the wafer testing process, we perform electrical testing on wafers entrusted to us by our customers. With our state-of-the-art testers and prober systems, we are capable of testing wafers ranging from 100 mm to 300 mm in logic, analog, and mixed-signal domains. Leveraging our extensive experience and proven track record, we provide reliable services through a well-established testing environment and quality control system.