WAFER TEST

Wafer Test / Laser Trimming Equipment < Test Environment >

The test environment information listed here is as of January 2025 and is provided for reference only.
For the most up-to-date specifications and testing environments, please contact us directly.

Main Test Environment for Mixed SoC Testers

Manufacturer	Model Name	Main Specifications
ADVANTEST	T6575	125MHz I/O＝512pin SCPG, AD/DA, IDDQ etc. options available
	T6577	125MHz I/O＝1024pin　I/O＝512pin available SCPG, ALPG, AFM, AD/DA options available
	T2000 LS	26slot TH, I/O＝1024pin DPS500mA, PMU32, 250MDM 52slot TH, I/O＝1024pin～1280pin DPS500mA, PMU32, 800MDM
	T7721	1125MHz I/O＝256pin　PHDC＝256pin MDC HDC SQPG MTX included
	V93000	9slot TH PS1600B=64MB/200Mbps/128ch/TMU:2pins WSMX=HS:4units , HR:4units DPS128=HV:64ch/HC:64ch

Analog Tester

Manufacturer	Model Name	Main Specifications
ShibaSoku	WL22	Perpin＝64ch TM＝2ch, HV V/I included CBIT＝72bit～288bit AS/AVM included
	WL25	Perpin＝64ch μFunc＝16pin～32pin TIME＝4ch CBIT＝72bit～144bit, HV V/I included
	WL25V	VPerpin＝64ch～128ch Digital Module＝16pin～32pin CBIT＝144bit～288bit TM＝8ch, HV V/I HV1800V included
SPANDNIX	SX3010	ONVI_R3M＝64pin 30V/300mA QTMR＝A/B×4ch Cbit＝256ch DHVI included

Prober

Manufacturer	Model Name	Main Specifications
Tokyo Electron	P-8 Series	(P8, P8XL) [100mm～200mm] Temperature Range： Room Temperature, High-Temperature Chuck, High-Temperature AC High / Low Temperature: -40°C to 150°C
Tokyo Electron	P-12 Series	(P-12) [200mm～300mm] Air-Cooled Configuration
ACCRETECH (Tokyo Seimitsu)	UF200 / 2000 Series	(UF200/A/SA/S/R) [125mm～200mm] (UF2000) [125mm～200mm] High-Temperature Chuck, High-Temperature AC High / Low Temperature: -40°C to 150°C
ACCRETECH (Tokyo Seimitsu)	UF3000 Series	(UF3000/EX/EXe) [200mm～300mm] High-Temperature Chuck, High-Temperature AC High / Low Temperature: -40°C to 150°C High / Low Temperature: -55°C to 200°C

Laser Trimming

Manufacturer	Model Name	Main Specifications
ESI	esi9275	Wavelength: 1047 µm 　Wafer Size: 4–8 inch
	esi9350	Wavelength: 1342 µm 　Wafer Size: 4–8 inch
	esi9820	Wavelength: 1342 µm 　Wafer Size: 6–8 inch

Back Grinder / Laser Grooving

Manufacturer	Model Name	Main Specifications
DISCO	DFG8560	Wafer Size: 6–12 inch 　　Finishing Wheel: #2000 / #6000 / #8000
DISCO	DFL7161	Wafer Size: 6–12 inch 　　Water-soluble Protective Film (Standard)

Additional Supporting Equipment

Manufacturer	Model Name	Main Specifications
Camtek	Falcon530	Automated Optical Inspection System (AOI) – 8 inch,12 inch compatible
Espec	PVHC-231M	Clean Oven
Tiatech	HOTEI	PAT Judgment System SPAT, DPAT, SBL, SYL Classification

Optimized Wafer Test Environment Covering a Wide Range of Requirements

In the wafer test process, we perform electrical testing on wafers entrusted to us by our customers.
With the latest testers and probers, we provide optimal test environments for wafers ranging from 100 mm to 300 mm, covering applications from logic to analog devices.
Backed by many years of experience and proven expertise, our robust quality management system ensures reliable and trustworthy testing services.