PROTOTYPING SERVICE
ABOUT
Supporting our customers from spot prototype fabrication to mass-production readiness
From experimental prototypes in the R&D phase to process-verification prototypes designed for a smooth transition to mass production, we provide flexible and rapid support tailored to your objectives.
Projects with undefined mass-production plans, as well as prototype requests declined by other companies, are also welcome. From single-unit small lots to large-scale prototyping of over 1,000 units, we support your development with speed, quality, and strong technical proposals.
In prototyping and development environments, the ability to quickly turn ideas into reality is critical. However, companies focused on mass production often find it difficult to accommodate small lots or short lead times. We address these “in-between” needs—bridging the gap between experimentation and mass production.
Projects with undefined mass-production plans, as well as prototype requests declined by other companies, are also welcome. From single-unit small lots to large-scale prototyping of over 1,000 units, we support your development with speed, quality, and strong technical proposals.
In prototyping and development environments, the ability to quickly turn ideas into reality is critical. However, companies focused on mass production often find it difficult to accommodate small lots or short lead times. We address these “in-between” needs—bridging the gap between experimentation and mass production.
Prototype Configuration
Prototype Configuration ①｜R&D Exploratory Prototyping
Turning ideas into reality with flexibility and speed.
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We flexibly support prototypes that are not intended for mass production, such as early-stage verification and evaluation.
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From idea validation and failure countermeasure testing to projects declined by other companies, we can respond quickly from a single unit.
Typical Support Examples
- Initial performance evaluation of ICs / MEMS, material evaluation, failure countermeasure evaluation, and analysis
- Flexible chip supply formats (die / packaged / wafer supported)
- Spot support for ad-hoc experiments and one-off evaluations
- No mass-production plan required (projects may be discontinued mid-way)
- Analog circuit design and PCB artwork support
Prototype Configuration ②｜Product-Oriented R&D Prototyping
Balancing development speed and quality with mass production in mind.
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Based on prototype results, we support verification to enable a smooth transition to mass production.
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From standard packages to custom modules, prototyping can be performed under conditions close to actual mass production.
Typical Support Examples
- Standard and custom package / module prototyping
- Short lead times and stable quality through domestic one-stop manufacturing
- Large-volume prototyping of 1,000 units or more
- Support for single processes only (assembly-only / evaluation-only)
- Condition selection and margin evaluation using mass-production equipment
Common Features Across Both Prototype Configurations
Reliable environments and a strong technical support system
Typical Support Examples
- High-quality manufacturing in cleanroom environments (Class 1,000 or lower)
- Urgent lead-time support (as short as 3 working days)
- Provision of reports covering experiments, assembly, evaluation, and analysis results
- Direct support and feedback from experienced engineers
- Process and condition proposals tailored to customer requirements
List of Supported Processes
Click each tab to view detailed information.
- Design
- Experiment / Prototyping / Evaluation
- Mass Production
- Wafer Test
- Wafer Processing
- Package / Module Assembly & Test
- SMD Assembly
- PCB / Product Assembly
- Product Inspection
Design
- CAE (Simulation)
- D-FMEA / P-FMEA
- 2D / 3D Simulation
- Circuit Design (Digital / Analog)
- Software Design
- Component Design / Selection
- PCB Pattern Design
- Mechanical Design
- Safety Design
- Thermal Design
- Noise Design
- Power Supply Design
- PCB Artwork
- PCB / FPC Fabrication
- Package / Module Design
- Enclosure Design
Experiment / Prototyping / Evaluation
- Component Procurement
- Prototype Process Design
- Mockup Fabrication
- Single-Unit to Small-Lot Fabrication
- Manual Assembly
- Assembly Using Mass-Production Equipment
- Various Measurements
- Assembly Evaluation
- Thermal Evaluation
- Noise Evaluation
- Evaluation / Analysis / Reliability Evaluation
Mass Production
- Mass Production Process Design
- Equipment / Jig Design
- System Development
- Test Program Development
- Outsourcing Management
Wafer Test
- Logic
- Mixed
- Analog (5–12 inch)
- Temperature Range: −55°C to 200°C
- Laser Trimming
Wafer Processing
- Back Grinding
- Laser Grooving
- Dicing
- Automated Optical Inspection
- Tray Loading
Package / Module Assembly & Test
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Bare Chip Assembly
Si
Compound Semiconductors (GaAs / SiC / GaN)
MEMS
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Die Bonding (DB)
Ag Paste
Insulating Paste
Solder Paste
DAF
Stack
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Passive Components
0201 and smaller
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Wire Bonding (WB) Technology
Forward / Reverse (BSOB)
Ultra-Low Profile
Au（φ17〜75μm）
Cu（φ20〜50μm）
Al（φ150/500μm）
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Flip Chip (FC) Technology
C4 (Solder Bump / Cu Pillar)
- SBB
- Plasma Cleaning
- Transfer Molding
- Potting
- Metal Cap Mounting
- Plasma Cleaning
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Encapsulation Technologies
Ultra-Low Profile
Partial Exposure
Cavity Package
Multi-Stage Molding
Transparent Resin / Lens
Resin Surface Shielding
Resin Surface Wiring
Partial Coating
Underfill
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Surface Treatment
Sn/SnBi
- Solder Ball Mounting
- Laser Marking
- Package Dicing
- Trim & Form
- Automated Optical Inspection
- Burn-In Test
- Final Test
- Taping
- Tray Packing
- Bulk-to-Tape / Tray
SMD Assembly
- Lead-Free Solder Assembly
- Eutectic Solder Assembly
- Laser Marking
- Large Component Mounting
- SMT (0201)
- Odd-Form Component Mounting
- Solder Ball Mounting
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Reflow
8–12 Zones
Vacuum
- Flux Cleaning
- 3D Optical Inspection
- X-ray Inspection
- CT Inspection
PCB / Product Assembly
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Soldering Assembly
Flow Soldering
Hand Soldering
Lead-Free / Eutectic Compatible
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Rework Technologies
Pattern Cutting
Jumper Wiring
PCB Rework (BGA Replacement)
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PCB Separation
Router Cutting
V-Groove Cutting
Product Inspection
- Electrical Testing
- Functional Testing
- Characteristic Adjustment
Functional Testing
System Testing
Data Adjustment
Prototype Flow
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Planning & Proposal -
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Design -
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Component Procurement -
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Experimental & Prototype Assembly -
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Mounting / Assembly -
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Evaluation & Analysis -
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Preparation for Mass Production
We provide comprehensive support ranging from spot fabrication for experiments and prototypes to full-scale mass production.
By leveraging the manufacturing facilities across all ARS business divisions, we support every process required for the development of semiconductors and electronic components, helping our customers accelerate commercialization and quickly resolve technical challenges.