USB-A（Ultra Small Board：Non-leaded / Glass Epoxy Substrate）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
4	2.10 x 1.40 x t0.60	0.65	glass epoxy	1.10 x 0.76 x t0.20
4	1.30 x 0.90 x t0.55	0.50	glass epoxy	0.60 x 0.60 x t0.15
4	1.50 x 2.00 x t0.65	0.80	glass epoxy	0.53 x 0.53 (2chip)
6	2.00 x 1.80 x t0.85	0.50	glass epoxy	1.00 x 1.40 x t0.27
6	2.00 x 1.80 x t0.70	0.50	glass epoxy	1.00 x 1.40 x t0.25

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USB-B（Ultra Small Board：Non-leaded / Nickel Electroformed Transfer Lead）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
3	1.20 x 1.20 x t0.60	0.60	(Ni) electro-forming	0.54 x 0.84 x t0.20
4	1.20 x 1.60 x t0.60	0.60	(Ni) electro-forming	0.60 x 0.80 x t0.25
6	2.00 x 1.80 x t0.60	0.50	(Ni) electro-forming	0.82 x 1.22 x t0.20
6	2.00 x 1.80 x t0.70	0.50	(Ni) electro-forming	0.82 x 1.22 x t0.20
10	2.60 x 2.90 x t0.60	0.50	(Ni) electro-forming	1.40 x 2.30 x t0.21
12	2.30 x 2.80 x t0.60	0.40	(Ni) electro-forming	1.10 x 1.00 x t0.20(Ag paste)
12	2.30 x 2.80 x t0.60	0.40	(Ni) electro-forming	1.30 x 1.10 x t0.25(dielectric)

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USB-C（Ultra Small Board：Non-leaded / Cu frame）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
8	5.00 x 4.50 x t0.75	1.00	Cu	2.50 x 3.50 x t0.25

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LNC（Lead Number Choose：Non-leaded / Glass Epoxy Substrate）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
4	2.85 x 1.15 x t0.75	0.65	glass epoxy	1.85 x 0.75 x t0.25
6	2.85 x 1.80 x t0.75	0.65	glass epoxy	1.85 x 1.40 x t0.25
8	2.85 x 2.45 x t0.65	0.65	glass epoxy	1.85 x 2.05 x t0.25
10	2.85 x 3.10 x t0.80	0.65	glass epoxy	1.85 x 2.70 x t0.25
12	2.85 x 1.80 x t0.80	0.65	glass epoxy	1.80 x 3.35 x t0.25
14	2.85 x 4.40 x t0.80	0.65	glass epoxy	1.85 x 4.00 x t0.25

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QFN（Quad Flat Non-leaded：Non-leaded / Glass Epoxy Substrate）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
6	1.00 x 1.20 x t0.45	0.80	glass epoxy	0.70 x 0.50 x t0.13
8	1.50 x 1.50 x t0.60	0.50	glass epoxy	0.80 x 0.80 x t0.25
8	1.50 x 1.50 x t0.80	0.50	glass epoxy	0.80 x 0.80 x t0.25
12	2.35 x 2.35 x t0.80	0.50	glass epoxy	1.65 x 1.65 x t0.30
16	2.85 x 2.85 x t0.80	0.50	glass epoxy	1.95 x 1.95 x t0.25

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SOT-23（Lead Package / Cu frame）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
3	1.60 x 2.90 x t1.10	1.90	Cu	1.00 x 1.00
5	1.60 x 2.90 x t1.10	0.95	Cu	1.30 x 1.00
6	1.60 x 2.90 x t1.10	0.95	Cu	1.30 x 0.80

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SOT-89（Lead Package / Cu frame）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
3	2.50 x 4.50 x t1.50	1.50	Cu	1.50 x 1.30
5	2.50 x 4.50 x t1.50	1.50	Cu	1.50 x 1.30

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SOP（Lead Package / Cu frame）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
8	3.9 x 4.9 x t1.6	1.27	Cu	—
24	5.3 x 8.2 x t1.9	0.65	Cu	—

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TSSOP（Lead Package / Cu frame）

pin	package size (mm)	lead pitch (mm)	substrate (lead frame)	max. chip size (mm)
8	4.4 x 3.1 x t1.1	0.65	Cu	—
16	4.4 x 5.0 x t1.0	0.65	Cu	—
20	4.4 x 6.5 x t1.1	0.65	Cu	—
24	5.6 x 7.8 x t1.1	0.65	Cu	—

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