Sensors & Communications
Using hollow, exposed, MCM, and stack processes, we deliver packages optimized for sensing and optical communication devices.
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Cu Frame Type
Ideal for heat dissipation
- Optical devices
- High-frequency devices
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PCB Type
Ideal for miniaturization
- Various MEMS sensors
- High-density / high-functional applications
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Custom Type
Power Modules / PMIC
We support module assembly processes including electronic component mounting → IGBT/ control IC mounting → wire bonding → resin encapsulation.
Module Configuration Examples
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PCB
modules
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PCB +
frame modules
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Frame
modules
Collective encapsulation
Product commercialization
Die Attach & Component Mounting
- Solder bonding
- Ag bonding (epoxy / sintering)
Bonding
- Al ・Cu
- Au（※Selectable within the same module）
Ultra-Compact / Low-Profile / High-Density
Through internal interconnections such as flip-chip mounting, we propose and realize compact, low-profile package designs.
Flip-chip mounting is achieved using solder bumps or Cu pillars combined with solder.
Cu pillar bonding
Ultra-low-profile wire bonding
Supported Package Types
SON/DFN・QFN・LGA・BGA
Interposers
Cu framePCBElectroformed substrates
High Reliability – Wettable Flank Non-Lead
ARS’s proprietary wettable flank structure ensures reliable solder fillet formation, achieving high soldering quality and improved post-assembly visual inspection.
Cu frame
PCB
