アルス株式会社|半導体・EMS・電源開発をワンストップで提供

SEMICONDUCTOR PKG ASSEMBLY

Supporting a Wide Range of Packages — from Standard to Custom Solutions

We support a broad range of semiconductor packages, from standard products to fully customized solutions. From process design and equipment/material selection to prototyping, mass production, and ongoing quality assurance, we work closely with our customers with sincerity and commitment at every stage. As an OSAT provider, we meet new development requirements with uncompromising quality and great cost effectiveness. To bring innovative package concepts to life, we continuously pursue and challenge advanced technologies.

Semiconductor Back-End Process Contract Services ABOUT

Flexible Solutions Tailored to Your Needs Delivering the Best Possible Service

We provide flexible manufacturing services tailored to each customer’s requirements—from single-unit spot prototyping and small-volume trials to small-lot mass production. Our domestic one-stop production system covers the entire semiconductor backend process, from wafer testing to semiconductor assembly, SMD PCB assembly, and electronic device assembly.

We support individual and partial processes, as well as integrated production flows.

  • ・Laser Grooving Equipment Available
    Supports wafers with Low-k films or those difficult to process using conventional blade dicing.
  • ・Vacuum Reflow Equipment Available
    Suitable for automotive-related assemblies such as power modules and PMICs.
  • ・Ball Mounting Equipment Available
    Supports BGA packages and custom modules.

Final testing support from low-pin-count to high-pin-count devices

  • ・Extensive experience with Logic, Mixed-Signal, and Analog devices
  • ・Optimal tester selection based on product specifications
  • ・Test-only services are also available upon request

Storage Services

  • We offer secure storage and shipping services for your valuable materials and products.
    From temporary to long-term storage, we flexibly accommodate diverse needs. Controlled environments with temperature and humidity management, as well as dust and ESD countermeasures, are also available.

Process Flow

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In addition to full turnkey processes, partial or short-process manufacturing services are also available.

Creating the Future Through Advanced Packaging Technology

We are a technology leader dedicated to the design and development of cutting-edge products, as well as a trusted manufacturing base for semiconductor and MEMS packages.