RELIABILITY TEST / ANALYSIS

RELIABILITY TEST SEMICONDUCTOR ANALYSIS FLOW

RELIABILITY TEST

Reliability Test Items and Facilities

Test Item	Abbreviation	Reference Standard	Test Description and Typical Conditions	Test Equipment
Pre-conditioning	PC	JESD22 A113	85℃／85%／168H＋Reflow	Temperature and humidity chamber, Reflow oven
High Temperature and Humidity Bias Test	THB	JESD22 A101	Evaluate resistance by applying electrical, thermal, and humidity stress for a long duration (Typical conditions: 85°C / 85% RH / Voltage = Operation Max / time)	Temperature and humidity chamber
Highly Accelerated Stress Test	HAST	JESD22 A110	Evaluate resistance by applying extremely severe temperature, humidity, and bias under pressurized conditions (Typical conditions: 130°C / 85% RH / Pressure 33.3 psia (230 kPa) / time)	Pressure steam chamber
Autoclave or Unbiased Highly Accelerated Stress Test	AC or UHST	JESD22 A102 JESD22 A118	121℃／100%／205kPa／time	Pressure steam chamber
Temperature Cycle Test	TC	JESD22 A104	Evaluate resistance to low temperature, high temperature, and temperature changes (Typical conditions: -65°C / 150°C (30 min) / cycle)	Temperature cycle tester
Power Temperature Cycle Test	PTC	JESD22 A105	Evaluate resistance to electrical and thermal stress changes caused by repeated switching operation at a stable case temperature over a long period (Typical conditions: -40°C / 125°C (5 min) / 1000 cycles, ΔTj ≥ 40°C)	Temperature cycle tester
High Temperature Storage Life Test	HTSL	JESD22 A103	Evaluate resistance when the device is stored under high-temperature conditions for a long period (Typical condition: Ta = Tstg.max)	Constant temperature chamber

Test Item	Abbreviation	Reference Standard	Test Description and Typical Conditions	Test Equipment
High Temperature Operating Life Test (Continuous Operation)	HTOL	JESD22 A108	Evaluate resistance by applying electrical stress (voltage, current) and thermal stress to the device for a long duration (Typical conditions: 125°C / Voltage = Operation Max / time)	Constant temperature chamber
Early Life Failure Rate Test (Initial Failure)	ELFR	AEC-Q100-008A	Conducted under specific conditions of the High Temperature Operating Life Test (HTOL)	Constant temperature chamber

Test Item	Abbreviation	Reference Standard	Test Description and Typical Conditions	Test Equipment
Wire Bond Shear Strength	WBS	AEC-Q100-001	Determine the reliability of the boundary of the formed metal joint (between the gold ball bond and the bonding surface on the package side)	Bond tester
Wire Bond Pull Strength	WBP	Mil-STD-883 Method2011	Verify wire bonding strength and fracture mode	Bond tester
Solderability Test	SD	JESD22 B102	Evaluate solder wettability on terminals (Typical conditions: solder bath temperature 245°C / immersion time 5 seconds / lead-free solder)	Solder bath
Solder Ball Shear Strength	SBS	AEC-Q100-010	Measure shear strength at the boundary between barrier metal and solder ball (Typically applied to solder ball mounted packages)	Bond tester
Solder Heat Resistance Test	B106C/ A112-A	JEITA ED- 4701/301A	260±5℃　10±3sec　2 cycles	Solder bath
Peel Strength Test		JEITA ED- 4702C/002	5N　10±1sec	Compact tabletop testing device
Adhesion Test		JEITA ED- 4702C/002	5N　10±1sec	Compact tabletop testing device
Board Bending Test		JEITA ED- 4702C/003A	3±0.5mm　5±1sec	Compact tabletop testing device

SEMICONDUCTOR ANALYSIS

List of Test Items

Electrical Characteristics	IV Characteristic Measurement Latch-up Test ESD Test TLP Measurement
Foreign Material Analysis	FTIR (Fourier Transform Infrared Spectroscopy) + Infrared Microscope
Visual / Micro Observation	Digital Microscope Analysis SEM Observation TEM / STEM Observation EDS Analysis EPMA Analysis
Laser-Based Observation	IR-OBIRCH Observation Backside IR Observation
Internal Analysis (Destructive)	Cross-Sectional Analysis (Ion Milling / FIB) Laser and Chemical Decapsulation Analysis EDS Analysis
Internal Analysis (Non-Destructive)	X-ray Inspection Ultrasonic (SAT) Inspection Other Electrical Characteristic Measurements
Other Analysis Items	Thermal Observation (Thermal) Emission Observation (Emission) FIB (Circuit Modification) Thermal Evaluation Noise Evaluation CAE (Simulation)

Test Details

Non-Destructive Inspection

Internal structures are observed non-destructively by X-ray inspection and SAT (Scanning Acoustic Tomography).
－ X-ray Inspection: Observes internal assembly structures to detect opens, shorts, and foreign materials. － SAT (Scanning Acoustic Tomography): Observes internal bonding conditions to detect voids, cracks, and interfacial delamination.

Package Decapsulation

Packages are opened using a combination of laser and chemical methods to minimize damage.
Internal observation is performed to identify chip cracks, wire breaks, and related failures.

Cross-Sectional Analysis

Cross-sectional structures and bonding conditions are observed through mechanical polishing.
Delamination, intermetallic compound (IMC) layers, and wire neck breaks are evaluated.

Foreign Material Analysis

Elemental analysis using EDS and material identification using FT-IR are performed.

CAE (Simulation)

Thermal and structural analyses are conducted to predict and evaluate the following:
－ Heat transfer (heat generation / cooling / thermal stress) － Structural mechanics (stress / deformation / fracture / moisture absorption)

Equipment Details

Equipment	Details
Semiconductor Testers	Semiconductor testers (T7722, T2000, V93000, D10, etc.) Semiconductor parameter analyzers
FT-IR Equipment	Fourier Transform Infrared Spectrometer (FT-IR)
Visual / Failure Analysis Equipment	Digital microscope Scanning Electron Microscope (SEM) Electron Probe Micro Analyzer (EPMA)
Emission / Thermal Observation	Emission microscope
Others	Laser equipment X-ray inspection system Ion milling system Cross-sectioning equipment Ultrasonic imaging system Compact tabletop testing machine Plastic mold opener Die shear testing system

Please feel free to contact us for more information.

Standard Test Items

This package menu focuses on the minimum required inspection items, leveraging our extensive experience in semiconductor manufacturing.

Item	Analysis / Inspection Details	Analytical Equipment Used
External Inspection	Marking characters, logo condition	Digital Microscope
External Inspection	External dimensions, lead condition	Digital Caliper
Internal Inspection	Internal structure verification	Digital Microscope
	Wire bonding condition	X-ray Inspection device
	Damage inspection using ultrasonic waves	SAT (Scanning Acoustic Tomography)

Test samples can be accepted starting from 1 piece.
Analysis can be performed even without comparison samples.
A sample format of the inspection report can be reviewed in advance.

Please note that this analysis does not include authenticity verification or quality guarantee.

FLOW

01

Inquiry

Please provide sample information, number of samples, and the planned shipment date.
※ Support via our authorized distributors is also available.
02

Quotation and Lead Time

We will provide a quotation and proposed schedule for execution.
03

Result Report

After testing is completed, an investigation report will be submitted as the deliverable, and the samples will be returned to you.